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? 1987 bipolar analog integrated circuit pc4560 high performance dual operational amplifier data sheet document no. g15805ej3v0ds00 (3rd edition) (previous no. ic-1978) date published october 2001 ns cp(k) printed in japan the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec representative for availability and additional information. the mark shows major revised points. description the pc4560 is a dual operational amplifier which features more improved slew rate and g.b. products than that of pc4559 with unity gain frequency compensation. also very low input noise and high output current drive capability make this device the optimum choice for audio applications and active filters. features ? internal frequency compensation ? gain bandwidth products: 10 mhz typ. ? low noise: 6 v p-p typ. ? high output current ordering information part number package pc4560c 8-pin plastic dip (7.62 mm (300)) pc4560g2 8-pin plastic sop (5.72 mm (225)) equivalent circuit (1/2 circuit) r 1 r 9 q 5 q 7 q 13 q 11 r 5 r 7 r 8 out q 2 q 1 q 8 9 q r 3 q 10 r 4 r 2 c 1 i i i n v v + ? q 15 q 4 q 3 c 2 d q 14 q 12 r 6 pin configuration (top view) pc4560c, 4560g2 1 1 2 3 4 8 7 6 5 v + out 2 i i2 i n2 + ? i i1 i n1 out 1 v ? 2 + ?
data sheet g15805ej3v0ds 2 pc4560 absolute maximum ratings (t a = 25c) parameter symbol ratings unit voltage between v + and v ? note 1 v + - v ? ?0.3 to +36 v differential input voltage v id 30 v input voltage note 2 v i v ? ?0.3 to v + +0.3 v output voltage note 3 v o v ? ?0.3 to v + +0.3 v c package note 4 700 mw power dissipation g2 package note 5 p t 440 mw output short circuit duration note 6 0sec operating ambient temperature t a ?20 to +80 c storage temperature t stg ?55 to +125 c notes 1. reverse connection of supply voltage can cause destruction. 2. the input voltage should be allowed to input without damage or destruction. even during the transition period of supply voltage, power on/off etc., this specification should be kept. the normal operation will establish when the both inputs are within the common mode input voltage range of electrical characteristics. 3. this specification is the voltage which should be allowed to supply to the output terminal from external without damage or destruction. even during the transition period of supply voltage, power on/off etc., this specification should be kept. the output voltage of normal operation will be the output voltage swing of electrical characteristics. 4. thermal derating factor is ?7.0 mw/c when operating ambient temperature is higher than 25c. 5. thermal derating factor is ?4.4 mw/c when operating ambient temperature is higher than 25c. 6. must not short to gnd, v + , v ? , and other voltage source. pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, note 4 and note 5. recommended operating conditions parameter symbol min. typ. max. unit supply voltage v 4 16 v
data sheet g15805ej3v0ds 3 pc4560 electrical characteristics (t a = 25c, v = 15 v) parameter symbol conditions min. typ. max. unit input offset voltage v io r s 10 ? 0.5 6.0 mv input offset current note i io 5 200 na input bias current note i b 60 500 na large signal voltage gain a v r l 2 k ? , v o = 10 v 20,000 180,000 power consumption p d i o = 0 a, both amplifiers 120 170 mw common mode rejection ratio cmr r s 10 k ? 70 100 db source variation rejection ratio svr r s 10 k ? 10 150 v/v r l 2 k ? 12 14 v output voltage swing v om i o = 25 ma 10 13 v common mode input voltage range v icm 12 14 v slew rate sr a v = 1 2.8 v/ s input equivalent noise voltage v n r s = 1 k ? , f = 1 hz to 1 khz (figure1) 6 v p-p channel separation f = 1 khz (figure2) 105 db note input bias currents flow out from ic, because each currents are base current of pnp-transistor on input stage.
data sheet g15805ej3v0ds 4 pc4560 measurement circuit figure1 noise measurement circuit 50 ? 1 k ? ? 15 v ? + 1 k ? 100 k ? +15 v v o v n = v o 2000 figure2 channel separation measurement circuit 50 k ? 50 ? v o2 v o1 channel separation = 20 log ( ) 1 1000 v o2 v o1 ? + 10 k ? 10 k ? + ?
data sheet g15805ej3v0ds 5 pc4560 typical performance characteristics (t a = 25c, typ.) 32 28 24 20 16 12 8 4 0 100 1 k 10 k 100 k 1 m large signal frequency response v om - output voltage swing - v p-p f - frequency - hz = 15 v v + _ _ + 0 20406080 output current limit v= 15 v 20 15 10 5 v o - output voltage - v i o - output current - ma v o , i o source + v o , i o sink ? 100 80 60 40 20 0 20 input bias current i b - input bias current - na t a - operating ambient temperature - ? c = 15 v v + _ _ + ? 20 0 40 60 80 100 120 80 60 40 20 0 1 10 1 k 100 k 1 m 10 m 100 10 k open loop frequency response a v - open loop voltage gain - db f- frequency - hz = 15 v v + _ _ + 800 600 400 200 0 20406080100 power dissipation p t - total power dissipation -mw t a - operating ambient temperature - ? c pc4560c pc4560g2 6 5 4 3 2 1 0 0 supply current i cc - supply current - ma v - supply voltage - v + _ 20 _ + 10 _ +
data sheet g15805ej3v0ds 6 pc4560 0 common mode input voltage range v icm - common mode input voltage range -v v - supply voltage - v 20 10 0 ? 10 ? 20 20 + _ 10 + _ v o - output voltage - v 0 ? 10 ? 5 5 10 voltage follower pulse response 40 30 20 10 0 t - time - s = 15 v v + _ _ + a v = 1 100 30 10 0 input equivalent noise voltage density 1 f - frequency - hz 1 k 10 100 e n - input equivalent noise voltage density - nv / hz r s = 100 f = 1 h z ? ?
data sheet g15805ej3v0ds 7 pc4560 application circuits head phone amp ? + + 10 k ? 51 k ? pc4560 100 k ? 51 k ? 10 k ? 100 ? +20 v 100 f 0.47 f 4.7 f ? c 4 r 7 r 5 r 1 c 3 10 f c 2 c 1 r 4 r 2 r 3 + ? + ? + ? 180 ? r 6 head phone 8 ? 2.5 mw typ. maximum power ? + + + + 2.2 k ? 390 k ? 36 k ? pc4560 33 f 56 k ? 1 k ? ? 15 v 100 f 10 k ? 100 f +15 v 33 f + 0.0022 f 0.01 f 47 f ? ? ? ? riaa amp 1.0 0.1 0.01 0.01 0.1 1.0 thd - total harmonic distortion - % v o - output voltage - v r.m.s. 0.001 1 total harmonic distortion c 3 c 4 c 6 c 5 r 6 r 5 r 4 c 7 c 2 c 1 r 1 r 3 r 2 + ? f = 1kh z
data sheet g15805ej3v0ds 8 pc4560 package drawings (unit : mm) 14 85 item millimeters notes 1. each lead centerline is located within 0.25 mm of its true position (t.p.) at maximum material condition. p8c-100-300b,c-2 n 0.25 p 0.9 min. r0 15 a 10.16 max. b 1.27 max. f 1.4 min. g 3.2 0.3 j 5.08 max. k 7.62 (t.p.) c 2.54 (t.p.) d 0.50 0.10 h 0.51 min. i 4.31 max. l 6.4 m 0.25 + 0.10 ? 0.05 2. ltem "k" to center of leads when formed parallel. m a r m p i j h g f dn c b 8-pin plastic dip (7.62mm(300)) l k
data sheet g15805ej3v0ds 9 pc4560 item b c i 8-pin plastic sop (5.72 mm (225)) d e f g h j p millimeters 1.27 (t.p.) 0.78 max. 4.4 0.15 0.1 0.1 0.42 1.59 0.21 6.5 0.3 1.49 + 0.08 ? 0.07 1.1 0.2 3 + 7 ? 3 note each lead centerline is located within 0.12 mm of its true position (t.p.) at maximum material condition. a 5.2 + 0.17 ? 0.20 k l m n 0.6 0.2 0.17 0.12 0.10 + 0.08 ? 0.07 s8gm-50-225b-6 85 1 4 s m c detail of lead end a m s n f g b e d p h i j k l
data sheet g15805ej3v0ds 10 pc4560 recommended soldering conditions when soldering this product, it is highly recommended to observe the conditions as shown below. if other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. for more details, refer to our document " semiconductor device mounting technology manual" (c10535e) . type of surface mount device pc4560g2: 8-pin plastic sop (5.72 mm (225)) process conditions symbol infrared ray reflow peak temperature: 230c or below (package surface temperature), reflow time: 30 seconds or less (at 210c or higher), maximum number of reflow processes: 1 time. ir30-00-1 vapor phase soldering peak temperature: 215c or below (package surface temperature), reflow time: 40 seconds or less (at 200c or higher), maximum number of reflow processes: 1 time. vp15-00-1 wave soldering solder temperature: 260c or below, flow time: 10 seconds or less, maximum number of flow processes: 1 time, pre-heating temperature: 120c or below (package surface temperature). ws60-00-1 partial heating method pin temperature: 300c or below, heat time: 3 seconds or less (per each side of the device). ? caution apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. type of through-hole device pc4560c: 8-pin plastic dip (7.62 mm (300)) process conditions wave soldering (only to leads) solder temperature: 260c or below, flow time: 10 seconds or less. partial heating method pin temperature: 300c or below, heat time: 3 seconds or less (per each lead). caution for through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered.
data sheet g15805ej3v0ds 11 pc4560 [memo]
pc4560 m8e 00. 4 the information in this document is current as of october, 2001. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec's data sheets or data books, etc., for the most up-to-date specifications of nec semiconductor products. not all products and/or types are available in every country. please check with an nec sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without prior written consent of nec. nec assumes no responsibility for any errors that may appear in this document. nec does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec semiconductor products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. nec assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec endeavours to enhance the quality, reliability and safety of nec semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. nec semiconductor products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. the recommended applications of a semiconductor product depend on its quality grade, as indicated below. customers must check the quality grade of each semiconductor product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec semiconductor products is "standard" unless otherwise expressly specified in nec's data sheets or data books, etc. if customers wish to use nec semiconductor products in applications not intended by nec, they must contact an nec sales representative in advance to determine nec's willingness to support a given application. (note) (1) "nec" as used in this statement means nec corporation and also includes its majority-owned subsidiaries. (2) "nec semiconductor products" means any semiconductor product developed or manufactured by or for nec (as defined above). ? ? ? ? ? ?

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